 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| INTEGRATED CIRCUITS DATA SHEET SL1ICS3101 I-CODE1 Label IC (97 pF) Product specification Supersedes data of 2000 Jul 01 2002 May 23 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 8 9 9.1 9.2 9.2.1 9.2.2 10 11 12 12.1 12.2 13 13.1 13.2 13.3 13.4 13.5 13.6 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION General Memory organization Serial number Write access conditions Special functions Family code and application identifier User data LIMITING VALUES QUALITY ASSURANCE Electrical acceptance test Visual inspection After wafer final test After sawing (film frame carrier) HANDLING INSTRUCTIONS ELECTRICAL CHARACTERISTICS MECHANICAL CHARACTERISTICS Die specifications Wafer specifications APPLICATION INFORMATION Protection against visible light Protection against UV light Resistance to X-rays Characterisation of inlet and label Final test of the inlet and label Coil specification 14 14.1 14.2 14.3 14.3.1 14.3.2 14.3.3 15 16 17 18 DELIVERY SL1ICS3101 Configuration of delivered ICs Packing Documentation Delivery documentation Fail-die identification Wafer mapping REFERENCE DOCUMENTS DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2002 May 23 2 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 1 FEATURES SL1ICS3101 * Operating frequency of 13.56 MHz * 512-bit read/write memory * Operating range up to 1.5 m with Electronic Article Surveillance (EAS) detection and up to 1.2 m for memory read and write * Anticollision: simultaneous operation of several labels * Reliable EAS detection avoids false alarms * Data retention of 10 years * Operating temperature from -25 to +70 C * In accordance with standards of the Federal Communications Commission (FCC 15 part 3) and European Telecommunications Standards Institute (ETSI EN 300 330 and EN 300 683) * Open communication protocol * Application identifier saves time. 2 APPLICATIONS 3 GENERAL DESCRIPTION The I-CODE1 label IC is a dedicated chip for intelligent label applications for logistics and retail (including EAS) and for baggage and parcel identification in airline business and mail services. The I-CODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (anticollision). It is designed for long range applications. Whenever connected to a very simple and cheap type of antenna (due to the 13.56 MHz carrier frequency) made out of a few windings printed, wound, etched or punched coil, the SL1ICS3101 operates without line of sight up to a distance of 1.5 m (gate width). * I-CODE(1) system labels. (1) I-CODE - is a trademark of Koninklijke Philips Electronics N.V. 4 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION unsawn wafer; 150 m; inked and mapped sawn wafer on foil (FFC); 150 m; inked and mapped VERSION - - SL1ICS3101U SL1ICS3101W wafer wafer 2002 May 23 3 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 5 BLOCK DIAGRAM SL1ICS3101 handbook, full pagewidth LA LB Cres DEMODULATOR ANALOG RF INTERFACE MODULATOR POWER SUPPLY DATA IN DATA OUT CLOCK VDD CLOCK DIGITAL CONTROL ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL RF INTERFACE CONTROL TEST VSS EEPROM 512 bits SL1ICS3101 MGU434 Fig.1 Block diagram. 6 PINNING SYMBOL DESCRIPTION bond pad for antenna coil connection A bond pad for antenna coil connection B test pad; this test pad is electrically neutral at sawn wafers electrical connection of the substrate pad; the pad is electrically neutral at sawn wafers LA handbook, halfpage LA LB TEST VSS TEST LB VSS MGW340 Fig.2 Pad locations. 2002 May 23 4 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 7 FUNCTIONAL DESCRIPTION 7.2 Memory organization SL1ICS3101 This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on Film Frame Carrier (FFC) of the SL1ICS3101 on a Philips 6C15 IDFW process and is the base for delivery of tested label ICs. General recommendations are given for storage, handling, and processing of wafers and for the assembly of labels. This product specification is valid for VCOL1V0 from mask revision NK:O and MB:B. 7.1 General The EEPROM has a memory capacity of 512 bits and is organised in 16 blocks consisting of 4 bytes each (see Table 1). A block is the smallest access unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the Least Significant Bit (LSB) and bit 7 the Most Significant Bit (MSB), respectively. The higher 12 blocks contain user data and the lowest 4 blocks contain the serial number, the write access conditions and some configuration bits. The values (in hexadecimal notation) are stored in the EEPROM after the wafer production process. The contents of blocks marked with `X' in Table 1 are not defined at delivery. The label requires no internal power supply (see Fig.1). Its contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the reader. The interface also demodulates data which is transmitted from the reader to the label IC, and modulates the electromagnetic field for data transmission from the label IC to the reader. Data is stored in a non-volatile memory (EEPROM). Table 1 EEPROM memory organization BYTE 0 SNR0 SNR4 F0 X X X X X X X X X X X X X BYTE 1 SNR1 SNR5 FF X X X X X X X X X X X X X BYTE 2 SNR2 SNR6 FF X X X X X X X X X X X X X BYTE 3 SNR3 SNR7 FF X X X X X X X X X X X X X BLOCK NUMBER 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 FUNCTION serial number (lower bytes) serial number (higher bytes) write access conditions special functions (EAS and QUIET) family code, application identifier and user data user data user data user data user data user data user data user data user data user data user data user data 2002 May 23 5 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 7.2.1 SERIAL NUMBER SL1ICS3101 The unique 64-bit serial number is stored in blocks 0 and 1 and is programmed during the production process. Byte SNR0 in the table represents the least significant byte and byte SNR7 the most significant byte, respectively. Table 2 Block 0 with serial number (lower bytes) BYTE 0 MSB Block 0 Name Table 3 SNR0 LSB MSB SNR1 BYTE 1 LSB MSB SNR2 BYTE 2 LSB MSB SNR3 BYTE 3 LSB XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX Block 1 with serial number (higher bytes) BYTE 0 MSB LSB MSB SNR4 WRITE ACCESS CONDITIONS SNR5 BYTE 1 LSB MSB SNR6 BYTE 2 LSB MSB SNR7 BYTE 3 LSB Block 1 Name 7.2.2 XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX The write access conditions in block 2 determine the write access for each of the 16 blocks. These bits can only be set to logic 0 (and never be changed to logic 1): therefore, already write protected blocks can never be written to from this moment on. This is also true for block 2. If this block is set into the write protected state by clearing of bits 5 and 4 at byte 0, no further changes in write access conditions are possible. The `ones' (11) in the 16 pairs of bits have to be cleared together if the corresponding block is wanted to be write protected forever: (11) for write access enabled and (00) write access disabled. Writing of bit pairs (10) or (01) to block 2 is not allowed. Remarks: It is extremely important to be particularly careful when clearing the write access bits in block 2, as you can lose write access to all of the blocks in case of a mistake. Of course, this feature can be used to put the SL1IC3101 into a hardware write protected state. Table 4 Block 2 with write access conditions for all blocks BYTE 0 MSB Block 2 Write access for block number 3 2 1 LSB MSB 0 7 6 5 BYTE 1 LSB MSB 4 11 10 9 BYTE 2 LSB MSB 8 15 14 13 BYTE 3 LSB 12 11110000111111111111111111111111 2002 May 23 6 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 7.2.3 SPECIAL FUNCTIONS SL1ICS3101 The special functions block 3 (see Table 5) holds the two bits E (EAS mode) and two bits Q (QUIET mode). The remaining 28 bits (marked X) are reserved for future use. If the electronic article surveillance mode is active (bits EE = 11), then the label answers at an EAS command. If the QUIET mode is enabled (setting bits QQ = 11), then the label is permanently disabled but can be activated again with the command RESET QUIET BIT. The label can be activated also by disabling the QUIET mode by setting bits QQ = 00. The state of the QUIET mode does not influence the functionality of the EAS command. Writing of bit pairs 10 or 01 to block 3 is not allowed. Remarks: Changing of the write access control or configuration must be done in a secure environment by reading the current value of the block and masking in the new values for bit positions that may be changed. The label must not be moved out of the communication field of the antenna during writing! We recommend to put the label close to the antenna and not to remove it during operation. Table 5 Block 3 with special functions BYTE 0 MSB Block 3 Name 7.2.4 XXXXQ not used LSB MSB QUIET EAS not used BYTE 1 LSB MSB not used BYTE 2 LSB MSB not used BYTE 3 LSB X Q EEXXXXXXXXXXXXXXXXXXXXXXX FAMILY CODE AND APPLICATION IDENTIFIER The I-CODE system offers the feature to use (independently) family codes and/or application identifiers with some reader commands. This allows for example the creation of `label families'. These two 8-bit values are located at the beginning of block 4 and are only evaluated if the bytes at the reader commands are unequal to zero. Only if both corresponding parameter bytes at the reader commands ANTICOLLISION/SELECT, EAS and UNSELECTED READ respectively, are set to logic 0, then block 4 can be used for user data without restriction. Bytes 2 and 3 are for customer usage. Table 6 Block 4 with family code and application ID BYTE 0 MSB Block 4 Name 7.2.5 family code USER DATA LSB MSB application ID BYTE 1 LSB MSB user data BYTE 2 LSB MSB user data BYTE 3 LSB XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX The remaining blocks 5 to 15 are for customer usage. 2002 May 23 7 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); notes 1 and 2. SYMBOL Tstg Tj Vesd Ii(LA-LB)(p) Notes PARAMETER storage temperature junction temperature electrostatic discharge voltage input current (peak value) note 3 note 4 CONDITIONS MIN. -55 -55 -2 -80 - - - - TYP. SL1ICS3101 MAX. +140 +140 +2 +80 UNIT C C kV mA 1. Stresses above those listed in this table may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in Chapter 11 is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 3. Human Body Model (HBM) in accordance with "MIL-STD-883D Method 3015.7". 4. At 13.56 MHz including current via resonant capacitor. 9 9.1 QUALITY ASSURANCE Electrical acceptance test 10 HANDLING INSTRUCTIONS Please refer to Philips "General specification for 6" wafer" for the following items: * Sawing * Die attach * Wire bonding. The electrical acceptance test is performed in line (`sampling on the fly') according to the test specifications. Sampling plan: * According to document "General quality specification". 9.2 9.2.1 Visual inspection AFTER WAFER FINAL TEST Performed according to document "SNW-FQ-627". Sampling plan: * According to document "General quality specification". 9.2.2 AFTER SAWING (FILM FRAME CARRIER) Performed according to document "PICTOH-QS007". Sampling plan (3 wafers per lot): * Accept 0 to 3. 2002 May 23 8 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 11 ELECTRICAL CHARACTERISTICS Tamb = -25 to +70 C; unless otherwise specified. SYMBOL General Tamb Tj Supply Pmin Inputs Cres Rmod Ii(LA-LB)(rms) Vi(LA-LB)(p) capacitance between pads LA and LB modulator-on resistance input current (RMS value) minimum input voltage (peak value) note 4 standard mode; note 5 read and EAS write fast mode; note 5; read, EAS and write Modulation mmin minimum modulation index of RF voltage for demodulator response maximum modulation index of RF voltage for demodulator response note 6 - 10 - - - 3.1 3.6 5.2 VLA-LB = 2 V (RMS); note 3 92 50 - 97 115 - minimum operating power VLA-LB = 2 V (RMS); note 2 - 450 ambient temperature junction temperature -25 -25 - - PARAMETER CONDITIONS MIN. TYP.(1) SL1ICS3101 MAX. UNIT C C W pF mA V V V +70 +85 - 102 250 50 3.7 4.1 6.5 14 % mmax note 6 30 - - % Timing foper tPW operating frequency modulation start-pulse length of RF voltage note 7 m 10%; note 8 standard mode fast mode tD EEPROM tret nwrite Notes 1. Typical ratings are not guaranteed. These values listed are at Tamb = 25 C. 2. Including losses in resonant capacitor and rectifier. 3. Measured with an HP4285A LCR meter at 13.56 MHz. 4. Including current via resonant capacitor. 5. The voltage between pads LA and LB is limited by the on-chip voltage limitation circuitry, corresponding to parameter Ii(LA-LB). 2002 May 23 9 EEPROM data retention time EEPROM write endurance Tamb 55 C 10 100000 - - - - years cycles demodulator response time m 10% 3.54 15.34 0.1 5.31(9) 17.11(9) 0.8 9.44 20.06 2.4 s s s 13.553 13.560 13.567 MHz Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) V max - V min 6. Definition: m = ----------------------------V max + V min 7. Bandwidth limitation (7 kHz) according to ISM band regulations. 8. The given values are derived from the 13.56 MHz system frequency. 9. Recommended values for pulse duration generated at the read/write device. 12 MECHANICAL CHARACTERISTICS 12.1 Die specifications PARAMETER Designation Bond pad location Bond pad size: LA and LB Test pad size: TEST and VSS Bond pad metallization material Metallization thickness Die dimensions (including 80 m scribe line) Die dimensions (excluding scribe line) Tolerances for sawn dies Pad identification Top side passivation material Passivation thickness Notes see Fig.3 130 x 150 m 90 x 90 m AlSiCu 1.4 m 1460 x 1490 m 1380 x 1410 m 25 m see Fig.2 oxynitride; notes 1 and 2 1.6 m VALUE VCOL1V0; visible on each die (see Fig.3) SL1ICS3101 1. The passivation is a protection of active areas against dust (particles), humidity, and general contamination (whole surface of the chip except for the bond pads). 2. Due to the glass-like physical properties careful handling and processing is required. 2002 May 23 10 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 handbook, full pagewidth 130 144.7 150 90 90 96.5 TEST LA 582.5 139.7 1490 (1) 1410 233.7 VCOL1V0 90 VSS 90 282.1 145 130 141.4 LB 150 1380 1460 (1) MGW341 Dimensions in m. (1) Including 80 m scribe line. Fig.3 Die dimensions. 2002 May 23 11 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 12.2 Wafer specifications For further information, please refer to the Philips documents: "Dicing process for thin wafers" and "General specification for 6" wafer". In case of doubt or inconsistency the mentioned wafer specifications are applicable. PARAMETER Designation Wafer diameter Die separation lane width Electrical connection of substrate Geometrically complete dies per wafer Orientation of dies relatively to wafer flat Position of test structures Wafer layout Batch size Process Backside treatment Wafer status Notes 1. Wafers can be delivered with a thickness of 525 m (untreated) or with 150 15 m (approximately 6 mil) ground and etched backside. 2. There are two wafer status: unsawn and sawn on FCC; both tested. Minimum yield per lot is 30%. 150 0.3 mm (150 mm = 6") 80 m (scribe line) VSS potential approximately 7400 see Fig.5 see Fig.5 see Fig.5 24 wafers 6C15 IDFW note 1 note 2 VALUE each wafer is laser scribed with batch and wafer number 2002 May 23 12 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 handbook, full pagewidth 13.41 13.14 MGW342 Dimensions in mm. Fig.4 Cluster plan. 2002 May 23 13 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 handbook, full pagewidth MGW358 Dimensions in mm. The three black areas show the position of the Process Control Module (PCM) structures on the 6 inch wafer. Fig.5 Cluster map. 2002 May 23 14 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 13 APPLICATION INFORMATION 13.1 Protection against visible light 13.4 SL1ICS3101 Characterisation of inlet and label As a result of the ultra low power design of the SL1ICS3101 some analog circuits on the chip are light sensitive. This means that common sunlight can impact the operation of the label if the chip is not protected against visible light radiation. Measurements have shown that a maximum radiation of E = 60 W/m2 (spectrum: 400 to 1000 nm) causes a reduced operating range of the plain chip. Measurements of direct sunlight in summer deliver values up to 260 W/m2. To ensure proper operation an expected minimum 260 radiation reduction factor of approximately 2 x --------- = 8.7 60 (round 9) must be provided by the encapsulation. That means special care has to be taken to ensure a sufficient light protection of the SL1ICS3101 (e.g. non translucent encapsulation or underfiller) according to application requirements. 13.2 Protection against UV light The parameters recommended to be characterised for the inlet and label are given in Table 7. For more detailed information on inlet and label characterization, please refer to Philips application note "I-CODE1 Label IC, Coil Design Guide" 13.5 Final test of the inlet and label Basic flow for production and test: * Production of wafer * Testing of dies on wafer * Writing of serial numbers and pre-configuration * Sawing of wafer * Assembly of inlets and labels * Final test of inlets and labels * Writing of customer data. To detect damage of EEPROM cells during production of inlets and labels a final test of the EEPROM after assembly of the inlet or label is recommended. This is necessary to achieve lowest failure rates. 13.6 Coil specification An EEPROM memory, as used in the SL1ICS3001, has some principle sensitivity to UV light (applies to EEPROM technology in general). Thus strong UV light exposure in the production of inlets or labels has to be avoided. UV light protection has to be ensured using appropriate assembly methods. 13.3 Resistance to X-rays The SL1ICS3101 has to be connected at pads LA and LB to a coil characterised by its electrical parameters according to Philips application note "I-CODE1 Label IC, Coil Design Guide". X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long term influence on the behaviour of the ICs nor on the data retention of the EEPROMs. Table 7 Inlet and label parameters PARAMETER resonant frequency threshold value for the field strength for command UNSELECTED READ (standard mode) threshold value for the field strength for command WRITE (standard mode) CONDITIONS at Tamb = 22 C and HTH; note 1 command UNSELECTED READ is OK SYMBOL fres HTH HWR Note command WRITE (and verifying read) is OK 1. If no command is transmitted to the inlet or label, then the label generates no response and there is no modulation. 2002 May 23 15 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 14 DELIVERY 14.1 Configuration of delivered ICs 14.3.2 FAIL-DIE IDENTIFICATION SL1ICS3101 The SL1ICS3101 is delivered with the following configuration by Philips: * Serial number is unique and read only * Write access conditions allow to change all blocks (with the exception of both serial number blocks) * Status of the EAS mode is not defined * Status of the QUIET mode is not defined * Family code and application identifier are not defined * User data memory is not defined. Remark: As the status of the QUIET mode is not defined at delivery, the first command to be executed on the SL1ICS3101 should be the command RESET QUIET BIT. 14.2 Packing Every die is electrically tested according to the data sheet. Identification of the chips which do not confirm with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at wafer periphery are identified by `FAIL'). 14.3.3 WAFER MAPPING Wafer mapping for failed die identification is available on floppy-disk (format 3.5", Electroglas ESC-ASCEND). Remark: The wafer map refers to unsawn wafers. At sawn wafers (on FFC) additional ICs might be inked (marked as `FAIL') if damaged during the sawing process (compared to wafer map). See Fig.6 for an example of the screen shot of a wafer map. The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips "General Specification for 6" wafer". 14.3 14.3.1 Documentation DELIVERY DOCUMENTATION Each wafer container and each larger shipment container is individually marked with the identification information as follows. * Diffusion batch number (wafer lot number) * Part designation (type) with revision number * Ordering code * Date code of lot acceptance * Good die quantity. The print out of the final test results is attached to the packing and contains the good die quantity related to every wafer number. 2002 May 23 16 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) SL1ICS3101 Fig.6 Screen shot of wafer map. handbook, full pagewidth MGW359 2002 May 23 17 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) Table 8 Map file of this example SL1ICS3101 ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE COPYRIGHT ASCEND LOT DEVICE PRODUCT WAFER READER XSTEP YSTEP XREF YREF XDELTA YDELTA FLAT XFRST YFRST PRQUAD COQUAD DIAM DATE TIME OPERATOR SET-UP FILE TEST SYSTEM TEST DATA PROBE CARD PROBER 09397 VCOL1HE2 VCOL\4020 05 09397-05-B6 575 UNITS 587 UNITS 16891 UNITS -261 UNITS 0 0 0 21 50 1 1 6000 UNITS 2000-01-23 15:30:00 4020 M:\SET\VCOL1HE2.SET SYS VCOL\4020 PC PIWP105 (0.1)MIL (0.1)MIL (0.1)MIL (0.1)MIL MIL : : :### shortening of the : : 3 X40Y3 5 X41Y3 5 X42Y3 5 X43Y3 5 X44Y3 5 X45Y3 5 X46Y3 5 X47Y3 2 X48Y3 2 X49Y3 2 X50Y3 5 X51Y3 5 X52Y3 5 X53Y3 5 X54Y3 5 : : :### shortening of the : : EDATE ETIME file ### 0 1 1 1 1 1 1 1 0 0 0 1 1 1 1 1 file ### 15 REFERENCE DOCUMENTS CATEGORY Standard Standard MISD standard MISD standard Data sheet Application note Application note NUMBER OR TITLE "MIL-STD 883D Method 3023" "MIL-STD-883D Method 3015.7" "SNW-FQ-627" "PICTOH-QS007" "General quality specification" "General Specification for 6" Wafer" "I-CODE1 Label IC, Coil Design Guide" "Dicing process for thin wafers" 2002 May 23 18 Philips Semiconductors Product specification I-CODE1 Label IC (97 pF) 16 DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS SL1ICS3101 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 17 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 May 23 19 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613502/02/pp20 Date of release: 2002 May 23 Document order number: 9397 750 08397 |
Price & Availability of SL1ICS3101
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |